143 plunger, filed a-d/or tented vias results

Manufacture and Characterization of a Novel Flip-Chip Package Z-interconnect Stack-up with RF Structures

SMTnet Express - June 27, 2019

SMTnet Express, June 27, 2019, Subscribers: 32,092, Companies: 10,819, Users: 24,882 Advanced Cu Electroplating Process for Any Layer Via Fill Applications with Thin Surface Copper Credits: MacDermid Inc. Copper-filled micro-vias are a key